Description

ATT ran an experiment varying five factors relevant to a wave-soldering procedure for mounting components on printed circuit boards. The response variable, skips, is a count of how many solder skips appeared to a visual inspection.

Usage

Format

A data frame with 900 observations on the following 6 variables.

Opening

a factor with levels L M S

Solder

a factor with levels Thick Thin

Mask

a factor with levels A1.5 A3 A6 B3 B6

PadType

a factor with levels D4 D6 D7 L4 L6 L7 L8 L9 W4 W9

Panel

a numeric vector

skips

count of how many solder skips appeared to a visual inspection

Source

Comizzoli, R. B., J. M. Landwehr, and J. D. Sinclair (1990). Robust materials and processes: Key to reliability. AT&T Technical Journal 69(6), 113-128.

Examples