Defects in a wave soldering process
Components are attached to an electronic circuit card assembly by a wave-soldering process. The soldering process involves baking and preheating the circuit card and then passing it through a solder wave by conveyor. Defect arise during the process. Design is 2^{7-3} with 3 replicates.
data(wavesolder)
A data frame with 16 observations on the following 10 variables.
Number of defects in the first replicate
Number of defects in the second replicate
Number of defects in the third replicate
prebake condition - a factor with levels 1 2
flux density - a factor with levels 1 2
conveyor speed - a factor with levels 1 2
preheat condition - a factor with levels 1 2
cooling time - a factor with levels 1 2
ultrasonic solder agitator - a factor with levels 1 2
solder temperature - facctor with levels 1 2
L. Condra (1993) Reliability improvement with design of experiments. Marcel Dekker, NY.
M. Hamada and J. Nelder (1997) Generalized linear models for quality improvement experiments, Journal of Quality Technology, 29, 292-304
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